Creating solutions for thermal property measurements
Problem statement
The existing 3-omega thin-film thermal measurement facility at UW-Madison is currently non-functional and unsuitable for routine research use due to missing components, broken circuits, outdated interfaces, and insufficient documentation. Without a reliable, user-friendly system, researchers cannot accurately measure the thermal resistance or conductivity of thin films, limiting ongoing and future experimental work in thermal characterization. To address this, the facility must be upgraded with redesigned electronics, modern data acquisition and control software, improved thermal isolation of the sample stage, and properly specified components. Additionally, a clear, standardized operating procedure and user manual must be developed to ensure consistent, repeatable measurements and to make the system accessible to a broad range of students and researchers. Completing these upgrades will deliver a robust, validated instrument that supports high-quality thermal property measurements for future research projects.
Team members
Joel Howarth – admin
Jacob Moreton – accountant
Martin Kleppek – facilitator
Thomas Merkatoris – communicator
Client
Eric Tervo
UW – Mechanical Engineering